Memory array staircase structure

ABSTRACT

Routing arrangements for 3D memory arrays and methods of forming the same are disclosed. In an embodiment, a memory array includes a first word line extending from a first edge of the memory array in a first direction, the first word line having a length less than a length of a second edge of the memory array perpendicular to the first edge of the memory array; a second word line extending from a third edge of the memory array opposite the first edge of the memory array, the second word line extending in the first direction, the second word line having a length less than the length of the second edge of the memory array; a memory film contacting the first word line; and an OS layer contacting a first source line and a first bit line, the memory film being disposed between the OS layer and the first word line.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims the benefit of U.S. Provisional Application No.63/058,615, filed on Jul. 30, 2020, which application is herebyincorporated herein by reference.

BACKGROUND

Semiconductor memories are used in integrated circuits for electronicapplications, including radios, televisions, cell phones, and personalcomputing devices, as examples. Semiconductor memories include two majorcategories. One is volatile memories; the other is non-volatilememories. Volatile memories include random access memory (RAM), whichcan be further divided into two sub-categories, static random accessmemory (SRAM) and dynamic random access memory (DRAM). Both SRAM andDRAM are volatile because they will lose the information they store whenthey are not powered.

On the other hand, non-volatile memories can keep data stored on them.One type of non-volatile semiconductor memory is ferroelectric randomaccess memory (FERAM, or FRAM). Advantages of FERAM include its fastwrite/read speed and small size.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A and 1B illustrate a perspective view and a circuit diagram of amemory array in accordance with some embodiments.

FIGS. 2, 3, 4A, 4B, 4C, 5A, 5B, 5C, 6A, 6B, 6C, 7A,7B, 7C, 8A, 8B, 8C,9A, 9B, 9C, 10A, 10B, 10C, 11A, 11B, 11C, 12A, 12B, 12C, 13A, 13B, 14A,14B, 15A, 15B, 15C, 16A, 16B, 17A, 17B, 18A, 18B, 19A, 19B, 20A, 20B,21A, 21B, 22A, 22B, 22C, 23A, 23B, 23C, 24A, 24B, 24C, 24D, 25A, 25B,25C, 25D, 26A, 26B, 26C, 26D, 26E, 27, 28, 29, 30, 31, 32, 33, 34, 35,36A, 36B, 36C, 36D, and 36E illustrate varying views of manufacturing asemiconductor device including a memory array in accordance with someembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Various embodiments provide a staircase structure for a 3D memory arraywith a plurality of stacked memory cells and a method for forming thesame. The stacked memory cells may be vertically stacked over acomplementary metal oxide semiconductor (CMOS) under array (CUA), whichmay be a logic die or the like. The stacked memory cells include wordlines extending in a direction parallel to a major surface of the CUA ina staircase structure in which respective lengths of the word linesdecrease in a direction away from the CUA. The staircase structure maybe formed adjacent a first border and extending only partially along thefirst border of the memory array in a first region and adjacent a secondborder and extending only partially along the second border of thememory array opposite the first border in a second region. The staircasestructure may be formed by depositing and patterning a hard mask overthe word lines, forming a photoresist over the hard mask, and performingrepeated trimming and etching processes on the photoresist and theunderlying word lines. In comparison with processes in which staircasestructures are formed along the entirety of the first border and thesecond border, forming the staircase structure along a portion of thefirst border in the first region and along a portion of the secondborder in the second region provides area saving benefits, whichincreases device density.

FIGS. 1A and 1B illustrate examples of a memory array 200, according tosome embodiments. FIG. 1A illustrates an example of a portion of thememory array 200 in a three-dimensional view, in accordance with someembodiments, and FIG. 1B illustrates a circuit diagram of the memoryarray 200. The memory array 200 includes a plurality of memory cells202, which may be arranged in a grid of rows and columns. The memorycells 202 may be further stacked vertically to provide a threedimensional memory array, thereby increasing device density. The memoryarray 200 may be disposed in the back end of line (BEOL) of asemiconductor die. For example, the memory array 200 may be disposed inthe interconnect layers of the semiconductor die, such as above one ormore active devices (e.g., transistors) formed on a semiconductorsubstrate.

In some embodiments, the memory array 200 is a flash memory array, suchas a NOR flash memory array or the like. Each of the memory cells 202may include a transistor 204 with a memory film 90. The memory film 90may serve as a gate dielectric. In some embodiments, a gate of eachtransistor 204 is electrically coupled to a respective word line (e.g.,a conductive line 72), a first source/drain region of each transistor204 is electrically coupled to a respective bit line (e.g., a conductiveline 106), and a second source/drain region of each transistor 204 iselectrically coupled to a respective source line (e.g., a conductiveline 108), which electrically couples the second source/drain region toground. The memory cells 202 in a same horizontal row of the memoryarray 200 may share a common word line, while the memory cells 202 in asame vertical column of the memory array 200 may share a common sourceline and a common bit line.

The memory array 200 includes a plurality of vertically stackedconductive lines 72 (e.g., word lines) with dielectric layers 52disposed between adjacent ones of the conductive lines 72. Theconductive lines 72 extend in a direction parallel to a major surface ofan underlying substrate (not separately illustrated in FIGS. 1A and 1B).The conductive lines 72 may have a staircase configuration such thatlower conductive lines 72 are longer than and extend laterally pastendpoints of upper conductive lines 72. For example, in FIG. 1A,multiple, stacked layers of conductive lines 72 are illustrated withtopmost conductive lines 72 being the shortest and bottommost conductivelines 72 being the longest. Respective lengths of the conductive lines72 may increase in a direction towards the underlying substrate. In thismanner, a portion of each of the conductive lines 72 may be accessiblefrom above the memory array 200, and conductive contacts may be made tocontact an exposed portion of each of the conductive lines 72.

The memory array 200 further includes a plurality of conductive lines106 (e.g., bit lines) and a plurality of conductive lines 108 (e.g.,source lines). The conductive lines 106 and the conductive lines 108 mayeach extend in a direction perpendicular to the conductive lines 72.Dielectric materials 98 are disposed between and isolate adjacent onesof the conductive lines 106 and the conductive lines 108. Pairs of theconductive lines 106 and the conductive lines 108 along with anintersecting conductive line 72 define boundaries of each memory cell202, and dielectric materials 102 are disposed between and isolateadjacent pairs of the conductive lines 106 and the conductive lines 108.In some embodiments, the conductive lines 108 are electrically coupledto ground. Although FIG. 1A illustrates a particular placement of theconductive lines 106 relative to the conductive lines 108, it should beappreciated that the placement of the conductive lines 106 and theconductive lines 108 may be flipped.

The memory array 200 may also include an oxide semiconductor (OS) layer92. The OS layer 92 may provide channel regions for the transistors 204of the memory cells 202. For example, when an appropriate voltage (e.g.,higher than a respective threshold voltage (V_(th)) of a correspondingtransistor 204) is applied through a corresponding conductive line 72, aregion of the OS layer 92 that intersects the conductive line 72 mayallow current to flow from the conductive lines 106 to the conductivelines 108 (e.g., in the direction indicated by arrow 206).

The memory film 90 is disposed between the conductive lines 72 and theOS layer 92, and the memory film 90 may provide gate dielectrics for thetransistors 204. In some embodiments, the memory film 90 comprises aferroelectric (FE) material, such as hafnium oxide, hafnium zirconiumoxide, silicon-doped hafnium oxide, or the like. Accordingly, the memoryarray 200 may be referred to as a ferroelectric random access memory(FERAM) array. Alternatively, the memory film 90 may be a multilayerstructure, a different ferroelectric material, a different type ofmemory layer (e.g., capable of storing a bit), or the like.

In embodiments in which the memory film 90 comprises an FE material, thememory film 90 may be polarized in one of two different directions. Thepolarization direction may be changed by applying an appropriate voltagedifferential across the memory film 90 and generating an appropriateelectric field. The polarization may be relatively localized (e.g.,generally contained within each boundaries of the memory cells 202) andcontinuous regions of the memory film 90 may extend across a pluralityof memory cells 202. Depending on a polarization direction of aparticular region of the memory film 90, a threshold voltage of acorresponding transistor 204 varies and a digital value (e.g., a 0 ora 1) can be stored. For example, when a region of the memory film 90 hasa first electrical polarization direction, the corresponding transistor204 may have a relatively low threshold voltage, and when the region ofthe memory film 90 has a second electrical polarization direction, thecorresponding transistor 204 may have a relatively high thresholdvoltage. The difference between the two threshold voltages may bereferred to as the threshold voltage shift. A larger threshold voltageshift makes it easier (e.g., less error prone) to read the digital valuestored in the corresponding memory cell 202.

To perform a write operation on a memory cell 202, a write voltage isapplied across a portion of the memory film 90 corresponding to thememory cell 202. The write voltage can be applied, for example, byapplying appropriate voltages to a corresponding conductive line 72(e.g., a corresponding word line) and the corresponding conductive lines106 and conductive lines 108 (e.g., corresponding bit and source lines).By applying the write voltage across the portion of the memory film 90,a polarization direction of the region of the memory film 90 can bechanged. As a result, the corresponding threshold voltage of thecorresponding transistor 204 can be switched from a low thresholdvoltage to a high threshold voltage or vice versa and a digital valuecan be stored in the memory cell 202. Because the conductive lines 72intersect the conductive lines 106 and the conductive lines 108,individual memory cells 202 may be selected for the write operation.

To perform a read operation on the memory cell 202, a read voltage(e.g., a voltage between the low and high threshold voltages) is appliedto the corresponding conductive line 72 (e.g., the corresponding wordline). Depending on the polarization direction of the correspondingregion of the memory film 90, the transistor 204 of the memory cell 202may or may not be turned on. As a result, the corresponding conductiveline 106 may or may not be discharged through the correspondingconductive line 108 (e.g., the corresponding source line that is coupledto ground), and the digital value stored in the memory cell 202 can bedetermined. Because the conductive lines 72 intersect the conductivelines 106 and the conductive lines 108, individual memory cells 202 maybe selected for the read operation.

FIG. 1A further illustrates reference cross-sections of the memory array200 that are used in later figures. Cross-section A-A′ is alonglongitudinal axes of conductive lines 72 and in a direction, forexample, parallel to the direction of current flow across the OS layer92 of the transistors 204. Cross-section B-B′ is perpendicular to thecross-section A-A′ and the longitudinal axes of the conductive lines 72.The cross-section B-B′ extends through the dielectric materials 98 andthe dielectric materials 102. Cross-section C-C′ is parallel to thecross-section B-B′ and extends through the conductive lines 106.Cross-section D-D′ is parallel to the cross-section A-A′ and extendsthrough the dielectric materials 102. Subsequent figures refer to thesereference cross-sections for clarity.

FIGS. 2 through 35 are views of intermediate stages in the manufacturingof the memory array 200, in accordance with some embodiments. FIGS. 2,3, 4B, 5B, 6B, 7B, 8B, 9B, 10B, 11B, 12B, 15B, 24B, 25B, 26B, and 36Bare illustrated along reference cross-section A-A′ illustrated in FIG.1A. FIGS. 4C, 5C, 6C, 7C, 8C, 9C, 10C, 11C, 12C, 13B, 14B, 15C, 16B,17B, 18B, 19B, 20B, 21B, 22B, 23B, 28, 29, 30, 31, 32, 33, 34, and 35are illustrated along reference cross-section B-B′ illustrated in FIG.1A. FIGS. 22C, 23C, 24C, 25C, 26C, and 36C are illustrated alongreference cross-section C-C′ illustrated in FIG. 1A. FIGS. 24D, 25D,26D, and 36D are illustrated along reference cross-section D-D′illustrated in FIG. 1A. FIGS. 4A, 5A, 6A, 7A, 8A, 9A, 10A, 11A, 12A,13A, 14A, 15A, 16A, 17A, 18A, 19A, 20A, 21A, 22A, 23A, 24A, 25A, 26A,27, and 36A illustrate top-down views. FIGS. 26E and 36E illustrateperspective views.

In FIG. 2, a substrate 50 is provided. The substrate 50 may be asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 50 may be an integrated circuit die, such as a logic die, amemory die, an ASIC die, or the like. The substrate 50 may be acomplementary metal oxide semiconductor (CMOS) die and may be referredto as a CMOS under array (CUA). The substrate 50 may be a wafer, such asa silicon wafer. Generally, an SOI substrate is a layer of asemiconductor material formed on an insulator layer. The insulator layermay be, for example, a buried oxide (BOX) layer, a silicon oxide layer,or the like. The insulator layer is provided on a substrate, typically asilicon or a glass substrate. Other substrates, such as multi-layered orgradient substrates may also be used. In some embodiments, thesemiconductor material of the substrate 50 may include silicon;germanium; a compound semiconductor including silicon carbide, galliumarsenide, gallium phosphide, indium phosphide, indium arsenide, and/orindium antimonide; an alloy semiconductor including silicon-germanium,gallium arsenide phosphide, aluminum indium arsenide, aluminum galliumarsenide, gallium indium arsenide, gallium indium phosphide, and/orgallium indium arsenide phosphide; or combinations thereof.

FIG. 2 further illustrates circuits that may be formed over thesubstrate 50. The circuits include transistors at a top surface of thesubstrate 50. The transistors may include gate dielectric layers 302over top surfaces of the substrate 50 and gate electrodes 304 over thegate dielectric layers 302. Source/drain regions 306 are disposed in thesubstrate 50 on opposite sides of the gate dielectric layers 302 and thegate electrodes 304. Gate spacers 308 are formed along sidewalls of thegate dielectric layers 302 and separate the source/drain regions 306from the gate electrodes 304 by appropriate lateral distances. Thetransistors may comprise fin field effect transistors (FinFETs),nanostructure (e.g., nanosheet, nanowire, gate-all-around, or the like)FETs (nano-FETs), planar FETs, the like, or combinations thereof, andmay be formed by gate-first processes or gate-last processes.

A first ILD 310 surrounds and isolates the source/drain regions 306, thegate dielectric layers 302, and the gate electrodes 304 and a second ILD312 is over the first ILD 310. Source/drain contacts 314 extend throughthe second ILD 312 and the first ILD 310 and are electrically coupled tothe source/drain regions 306 and gate contacts 316 extend through thesecond ILD 312 and are electrically coupled to the gate electrodes 304.An interconnect structure 320 including one or more stacked dielectriclayers 324 and conductive features 322 formed in the one or moredielectric layers 324 is over the second ILD 312, the source/draincontacts 314, and the gate contacts 316. The interconnect structure 320may be electrically connected to the gate contacts 316 and thesource/drain contacts 314 to form functional circuits. In someembodiments, the functional circuits formed by the interconnectstructure 320 may comprise logic circuits, memory circuits, senseamplifiers, controllers, input/output circuits, image sensor circuits,the like, or combinations thereof. Although FIG. 2 discusses transistorsformed over the substrate 50, other active devices (e.g., diodes or thelike) and/or passive devices (e.g., capacitors, resistors, or the like)may also be formed as part of the functional circuits. The transistors,the ILDs, and the interconnect structure 320 formed over the substrate50 may be omitted from subsequent drawings for the purposes ofsimplicity and clarity. The substrate 50 along with the transistors(e.g., the source/drain regions 306, the gate dielectric layers 302, andthe gate electrodes 304), the gate spacers 308, the first ILD 310, thesecond ILD 312, and the interconnect structure 320 may be a CMOS underarray (CUA), a logic die, or the like.

In FIG. 3, an etch stop layer 51 and a multi-layer stack 58 are formedover the substrate 50. Although the etch stop layer 51 is illustrated ascontacting the substrate 50, any number of intermediate layers may bedisposed between the substrate 50 and the etch stop layer 51. Forexample, one or more interconnect layers comprising conductive featuresin insulting layers (e.g., low-k dielectric layers) may be disposedbetween the substrate 50 and the etch stop layer 51. In someembodiments, the conductive features may be patterned to provide power,ground, and/or signal lines for the active devices on the substrate 50and/or the memory array 200 (see FIGS. 1A and 1B).

The etch stop layer 51 may act as a stop for etching processessubsequently performed on overlying layers, such as the layers of themulti-layer stack 58. The etch stop layer 51 may be formed of a materialhaving a high etch selectivity to the materials of the multi-layer stack58 such that the multi-layer stack 58 may be etched withoutsignificantly etching the etch stop layer 51. In some embodiments, theetch stop layer 51 may be formed of silicon nitride, SiON, SiCON, SiC,SiOC, SiC_(x)N_(y), SiO_(x), other dielectrics, combinations thereof, orthe like, and may be formed by chemical vapor deposition (CVD), atomiclayer deposition (ALD), or the like.

The multi-layer stack 58 includes alternating layers of conductivelayers 54A-54D (collectively referred to as conductive layers 54) anddielectric layers 52A-52E (collectively referred to as dielectric layers52). The conductive layers 54 may be patterned in subsequent steps todefine conductive lines 72 (e.g., word lines). The conductive layers 54may comprise conductive materials, such as, copper, titanium, titaniumnitride, tantalum, tantalum nitride, tungsten, ruthenium, aluminum,cobalt, silver, gold, nickel, chromium, hafnium, platinum, combinationsthereof, or the like. The dielectric layers 52 may comprise insulatingmaterials, such as silicon oxide, silicon nitride, silicon oxynitride,combinations thereof, or the like. The conductive layers 54 and thedielectric layers 52 may each be formed using, for example, CVD, ALD,physical vapor deposition (PVD), plasma enhanced CVD (PECVD), or thelike. Although FIG. 3 illustrates a particular number of the conductivelayers 54 and the dielectric layers 52, other embodiments may includedifferent numbers of the conductive layers 54 and the dielectric layers52.

FIGS. 4A through 10C illustrate patterning the multi-layer stack 58 toform a staircase structure 68 (illustrated in FIGS. 10A through 10C). InFIGS. 4A through 4C, a patterned hard mask 57 is formed over themulti-layer stack 58. The patterned hard mask 57 may act as a mask foretching the multi-layer stack 58 to form the staircase structure 68 inselected portions of the multi-layer stack 58. In some embodiments, theselected regions of the multi-layer stack 58 may correspond to locationsof the subsequently formed staircase structure 68. A hard mask layer(not separately illustrated) may be deposited on a top surface of thedielectric layer 52E. The hard mask layer may be deposited by CVD, ALD,or the like. The hard mask layer may then be patterned using alithography process to form the patterned hard mask 57. The hard masklayer may comprise amorphous silicon (a-Si), silicon carbide (SiC),silicon oxycarbide (SiOC), silicon oxycarbonitride (SiOCN), siliconcarbonitride (SiCN), a high-k dielectric material, combinations ormultiple layers thereof, or the like.

As illustrated in FIG. 4A, the patterned hard mask 57 may be patternedto include a first opening 59A exposing a first portion of thedielectric layer 52E and a second opening 59B exposing a second portionof the dielectric layer 52E. The first opening 59A may be formedextending from a first edge E₁ and a second edge E₂ of the structure andthe second opening 59B may be formed extending from a third edge E₃ anda fourth edge E₄ of the structure opposite the first edge E₁ and thesecond edge E₂. As illustrated in FIG. 4A, the first opening 59A and thesecond opening 59B may be staggered in a direction parallel to thesecond edge E₂ and the fourth edge E₄. The staircase structure 68 willsubsequently be formed by patterning through the first opening 59A andthe second opening 59B. Forming the first opening 59A and the secondopening 59B in the staggered configuration of FIG. 4A allows for thestaircase structure 68 to be formed with a staggered configuration. Thisallows for connections to be made between the conductive layers 54A-54Dand circuits on the underlying substrate 50 proximal both the secondedge E₂ and the fourth edge E₄, with area savings compared to deviceswhich include staircase structures extending along the length of thesecond edge E₂ and the fourth edge E₄. Moreover, including the patternedhard mask 57 allows for patterning and trimming of a photoresist (suchas the photoresist 56, discussed below with respect to FIGS. 5A through9C) subsequently formed over the patterned hard mask 57 to besimplified, helps to protect portions of the multi-layer stack 58 fromundesired etching, and improves the accuracy of patterning the staircasestructure 68. This reduces costs, reduces device defects, and improvesdevice performance.

FIG. 4A further illustrates reference cross-sections that are used inlater figures. Cross-section A-A′ extends through the first opening 59Aalong longitudinal axes of subsequently formed conductive lines (such asthe conductive lines 72, discussed below with respect to FIGS. 14A and14B). Cross-section B-B′ extends through the second opening 59B in adirection perpendicular to cross-section A-A′.

In FIGS. 5A through 5C a photoresist 56 is formed over the multi-layerstack 58 and the patterned hard mask 57. The photoresist 56 can beformed by using a spin-on technique and can be patterned usingacceptable photolithography techniques. Patterning the photoresist 56may expose the multi-layer stack 58 in a region 60, while maskingremaining portions of the multi-layer stack 58. For example, a topmostlayer of the multi-layer stack 58 (e.g., the dielectric layer 52E) maybe exposed in the region 60.

In FIGS. 6A through 6C, the exposed portions of the multi-layer stack 58in the region 60 are etched using the photoresist 56 as a mask. Theetching may be any acceptable etch process, such as wet or dry etching,RIE, NBE, the like, or a combination thereof. The etching may beanisotropic. The etching may remove portions of the dielectric layer 52Eand the conductive layer 54D in the region 60 and define an opening 61.Because the dielectric layer 52E and the conductive layer 54D havedifferent material compositions, etchants used to remove exposedportions of these layers may be different. In some embodiments, theconductive layer 54D acts as an etch stop layer while etching thedielectric layer 52E, and the dielectric layer 52D acts as an etch stoplayer while etching the conductive layer 54D. As a result, the portionsof the dielectric layer 52E and the conductive layer 54D may beselectively removed without removing remaining layers of the multi-layerstack 58, and the opening 61 may be extended to a desired depth.Alternatively, a timed etch processes may be used to stop the etching ofthe opening 61 after the opening 61 reach a desired depth. In theresulting structure, the dielectric layer 52D is exposed in the region60.

In FIGS. 7A through 7C, the photoresist 56 is trimmed to exposeadditional portions of the multi-layer stack 58. The photoresist 56 canbe trimmed using acceptable photolithography techniques. As a result ofthe trimming, a width of the photoresist 56 is reduced, and portions ofthe multi-layer stack 58 in the region 60 and a region 62 are exposed.For example, top surfaces of the dielectric layer 52E in the region 62and top surfaces of the dielectric layer 52D in the region 60 may beexposed.

Exposed portions of the multi-layer stack 58 may then be etched usingthe photoresist 56 as a mask. The etching may be any suitable etchingprocess, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching process may be anisotropic. The etchingmay extend the opening 61 further into the multi-layer stack 58. Becausethe dielectric layers 52 and the conductive layers 54 have differentmaterial compositions, etchants used to remove exposed portions of theselayers may be different. In some embodiments, the conductive layers 54act as etch stop layers while etching the dielectric layers 52, and thedielectric layers 52 act as etch stop layers while etching conductivelayers 54. As a result, the portions of the dielectric layers 52 and theconductive layers 54 may be selectively removed without removingremaining layers of the multi-layer stack 58, and the opening 61 may beextended to a desired depth. Alternatively, timed etch processes may beused to stop the etching of the opening 61 after the opening 61 reachesa desired depth. Further, during the etching process, un-etched portionsof the dielectric layers 52 and the conductive layers 54 act as masksfor underlying layers, and as a result a previous pattern of thedielectric layer 52E and the conductive layer 54D (see FIGS. 6A through6C) may be transferred to the underlying dielectric layer 52D and theunderlying conductive layer 54C. In the resulting structure, thedielectric layer 52D is exposed in the region 62 and the dielectriclayer 52C is exposed in the region 60.

In FIGS. 8A through 8C, the photoresist 56 is trimmed to exposeadditional portions of the multi-layer stack 58. The photoresist 56 canbe trimmed using acceptable photolithography techniques. As a result ofthe trimming, a width of the photoresist 56 is reduced, and portions ofthe multi-layer stack 58 in the region 60, the region 62, and a region64 are exposed. For example, top surfaces of the dielectric layer 52E inthe region 64, top surfaces of the dielectric layer 52D in the region62, and top surfaces of the dielectric layer 52C in the region 60 may beexposed.

Exposed portions of the multi-layer stack 58 may then be etched usingthe photoresist 56 as a mask. The etching may be any suitable etchingprocess, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching process may be anisotropic. The etchingmay extend the opening 61 further into the multi-layer stack 58. Becausethe dielectric layers 52 and the conductive layers 54 have differentmaterial compositions, etchants used to remove exposed portions of theselayers may be different. In some embodiments, the conductive layers 54act as etch stop layers while etching the dielectric layers 52, and thedielectric layers 52 act as etch stop layers while etching conductivelayers 54. As a result, the portions of the dielectric layers 52 and theconductive layers 54 may be selectively removed without removingremaining layers of the multi-layer stack 58, and the opening 61 may beextended to a desired depth. Alternatively, timed etch processes may beused to stop the etching of the opening 61 after the opening 61 reachesa desired depth. Further, during the etching process, un-etched portionsof the dielectric layers 52 and the conductive layers 54 act as masksfor underlying layers, and as a result a previous pattern of thedielectric layer 52E, the conductive layer 54D, the dielectric layer52D, and the conductive layer 54C (see FIGS. 7A through 7C) may betransferred to the underlying dielectric layer 52C, the underlyingconductive layer 54B, the underlying dielectric layer 52D, and theunderlying conductive layer 54C. In the resulting structure, thedielectric layer 52D is exposed in the region 64, the dielectric layer52C is exposed in the region 62 and the dielectric layer 52B is exposedin the region 60.

In FIGS. 9A through 9C, the photoresist 56 is trimmed to exposeadditional portions of the multi-layer stack 58. The photoresist 56 canbe trimmed using acceptable photolithography techniques. As a result ofthe trimming, a width of the photoresist 56 is reduced, and portions ofthe multi-layer stack 58 in the region 60, the region 62, the region 64,and a region 66 are exposed. For example, top surfaces of the dielectriclayer 52E in the region 66, top surfaces of the dielectric layer 52D inthe region 64, top surfaces of the dielectric layer 52C in the region62, and top surfaces of the dielectric layer 52B in the region 60 may beexposed.

Exposed portions of the multi-layer stack 58 may then be etched usingthe photoresist 56 as a mask. The etching may be any suitable etchingprocess, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching process may be anisotropic. The etchingmay extend the opening 61 further into the multi-layer stack 58. Becausethe dielectric layers 52 and the conductive layers 54 have differentmaterial compositions, etchants used to remove exposed portions of theselayers may be different. In some embodiments, the conductive layers 54act as etch stop layers while etching the dielectric layers 52. As aresult, the portions of the dielectric layers 52 may be selectivelyremoved without removing remaining layers of the multi-layer stack 58,and the opening 61 may be extended to a desired depth. Alternatively,timed etch processes may be used to stop the etching of the opening 61after the opening 61 reaches a desired depth. Further, during theetching process, un-etched portions of the dielectric layers 52 and theconductive layers 54 act as masks for underlying layers, and as a resulta previous pattern of the dielectric layer 52E, the conductive layer54D, the dielectric layer 52D, the conductive layer 54C, the dielectriclayer 52C, and the conductive layer 54B (see FIGS. 8A through 8C) may betransferred to the underlying dielectric layer 52B, the underlyingdielectric layer 52C, and the underlying dielectric layer 52D. In theresulting structure, the conductive layer 54A is exposed in the region60, the conductive layer 54B is exposed in the region 62, the conductivelayer 54C is exposed in the region 64, and the conductive layer 54D isexposed in the region 66.

In FIGS. 10A through 10C the photoresist 56 may be removed, such as byan acceptable ashing or wet strip process. Thus, a staircase structure68 is formed. The staircase structure 68 comprises a stack ofalternating layers of the dielectric layers 52 and the conductive layers54. As illustrated in FIGS. 10A through 10C, forming the staircasestructure 68 allows for portions of each of the conductive layers54A-54D to be exposed from overlying conductive layers 54 and dielectriclayers 52. As a result, conductive contacts can be made from above thestaircase structure 68 to each of the conductive layers 54 in subsequentprocessing steps.

As illustrated in FIG. 10A, the staircase structure 68 includes a firstportion 68A and a second portion 68B opposite the first portion 68A. Thefirst portion 68A may be disposed in a first corner of the memory array200 and the second portion 68B may be disposed in a second corner of thememory array 200 opposite (e.g., kitty corner) the first corner. Thepatterned hard mask layer 57 may cover a third corner of the memoryarray 200 between the first corner and the second corner and a fourthcorner of the memory array 200 opposite (e.g., kitty corner) the thirdcorner. The first portion 68A extends only partially along the secondedge E₂ of the memory array 200 and the second portion 68B extends onlypartially along the fourth edge E₄ of the memory array 200. Theconductive layers 54 may be subsequently etched to form conductive lines(e.g. word lines, such as the conductive lines 72, discussed below withrespect to FIGS. 14A and 14B). Forming the staircase structure 68including the first portion 68A and the second portion 68B which extendpartially along the second edge E₂ and the fourth edge E₄, respectively,allows for connections (such as the conductive contacts 122, discussedbelow with respect to FIGS. 26A through 26E) to be made to each of theconductive lines, while consuming a minimal footprint of the memoryarray 200. This allows for device density to be increased. In FIGS. 4Athrough 10C, a sidewall of the patterned hard mask 57 which defines thesecond portion 68B of the staircase structure 68 is illustrated as beingmisaligned from a sidewall of the patterned hard mask 57 which definesthe first portion 68A of the staircase structure 68. However, asillustrated by the dotted line in FIG. 10A, the sidewalls of thepatterned hard mask 57 which define the first portion 68A and the secondportion 68B of the staircase structure 68 may be aligned.

The conductive layers 54 may be continuous outside of the first portion68A and the second portion 68B of the staircase structure 68. As such,conductive lines formed from portions of the conductive layers 54extending into the first portion 68A may extend to the fourth edge E₄and conductive lines formed from portions of the conductive layers 54extending into the second portion 68B may extend to the second edge E₂.As illustrated in FIG. 10B, edges of the conductive layers 54 and thedielectric layers 52 opposite the first portion 68A of the staircasestructure 68 may be coterminous with edges of the etch stop layer 51 andthe substrate 50. As illustrated in FIG. 10C, edges of the conductivelayers 54 and the dielectric layers 52 opposite the second portion 68Bof the staircase structure 68 may be coterminous with edges of the etchstop layer 51 and the substrate 50.

In FIGS. 11A through 11C, an inter-metal dielectric (IMD) 70 isdeposited over the multi-layer stack 58. The IMD 70 may be formed of adielectric material, and may be deposited by any suitable method, suchas CVD, PECVD, flowable CVD (FCVD), or the like. The dielectricmaterials may include phospho-silicate glass (PSG), boro-silicate glass(BSG), boron-doped phospho-silicate glass (BPSG), undoped silicate glass(USG), or the like. In some embodiments, the IMD 70 may comprise anoxide (e.g., silicon oxide or the like), a nitride (e.g., siliconnitride or the like), a combination thereof or the like. Otherdielectric materials formed by any acceptable process may be used. TheIMD 70 extends along sidewalls of the conductive layers 54B-54D,sidewalls of the dielectric layers 52B-52E, sidewalls of the patternedhard mask 57, top surfaces of the conductive layers 54A-54D, and topsurfaces of the patterned hard mask 57.

In FIGS. 12A through 12C, a removal process is applied to the IMD 70 andthe patterned hard mask 57 to remove excess materials over themulti-layer stack 58. In some embodiments, a planarization process suchas a chemical mechanical planarization (CMP) process, an etch-backprocess, a combination thereof, or the like may be utilized. In theembodiment illustrated in FIGS. 12A through 12C, the patterned hard mask57 may be completely removed. The planarization process exposes themulti-layer stack 58 such that a top surface of the multi-layer stack 58(e.g., the dielectric layer 52E) is level with top surfaces of the IMD70 after the planarization process is complete.

In FIGS. 13A through 15C, trenches 86 are formed in the multi-layerstack 58, thereby defining conductive lines 72. The conductive lines 72may correspond to word lines in the memory array 200 and the conductivelines 72 may provide gate electrodes for the resulting transistors 204of the memory array 200 (see FIGS. 1A and 1B).

In FIGS. 13A and 13B a hard mask 80 is deposited over the multi-layerstack 58. The hard mask 80 may include, for example, silicon nitride,silicon oxynitride, or the like, which may be deposited by CVD, PVD,ALD, PECVD, or the like. The hard mask 80 can be formed by using aspin-on technique and can be patterned using acceptable photolithographytechniques. A photoresist 82 is formed and patterned over the hard mask80. The photoresist 82 may be patterned to form trenches 86 exposingportions of a top surface of the hard mask 80.

In FIGS. 14A and 14B, a pattern of the photoresist 82 is transferred tothe hard mask 80 using an acceptable etching process, such as wet or dryetching, RIE, NBE, the like, or a combination thereof. The etching maybe anisotropic. The etching may expose top surfaces of the multi-layerstack 58, such as top surfaces of the dielectric layer 52E. Thus, thetrenches 86 are transferred to the hard mask 80. Further in FIGS. 14Aand 14B, the photoresist 82 may be removed by an acceptable process,such as a wet etching process, a dry etching process, a combinationthereof, or the like.

In FIGS. 15A through 15C, a pattern of the hard mask 80 is transferredto the multi-layer stack 58 using one or more acceptable etchingprocesses, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching processes may be anisotropic. Thus, thetrenches 86 are extended through the multi-layer stack 58. The trenches86 may expose top surfaces of the etch stop layer 51. The conductivelines 72A-72D (e.g., word lines, collectively referred to as conductivelines 72) are formed from the conductive layers 54A-54D by etching thetrenches 86. More specifically, by etching the trenches 86 through theconductive layers 54, adjacent conductive lines 72 can be separated fromeach other. The conductive lines 72 may be continuous outside of thefirst portion 68A and the second portion 68B of the staircase structure68. The conductive lines 72 formed from portions of the conductivelayers 54 extending into the first portion 68A may extend to the fourthedge E₄ and the conductive lines 72 formed from portions of theconductive layers 54 extending into the second portion 68B may extend tothe second edge E₂. Further in FIGS. 15A through 15C, the hard mask 80may be removed by an acceptable process, such as a wet etching process,a dry etching process, a planarization process, combinations thereof, orthe like.

Opposite end surfaces of the conductive lines 72A and the dielectriclayer 52A may be coterminous with the second edge E₂ and the fourth edgeE₄ of the IMD 70. First ends of the conductive lines 72B-72D and thedielectric layers 52B-52E in the first portion 68A and the secondportion 68B of the staircase structure 68 may contact the IMD 70 andopposite second ends of the same conductive lines 72B-72D and thedielectric layers 52B-52E may be coterminous with the opposite IMD 70.This aids in maximizing the use of available area in the memory array200, as no extra area is taken up by the IMD along end surfaces of theconductive lines 72A and the dielectric layer 52A, and memory cells 202can be formed along the lengths of the conductive lines 72 and thedielectric layers 52 outside of the first portion 68A and the secondportion 68B of the staircase structure 68.

FIGS. 16A through 19B illustrate forming and patterning channel regionsfor the transistors 204 (see FIGS. 1A and 1B) in the trenches 86. InFIGS. 16A and 16B, a memory film 90, an OS layer 92, and a firstdielectric layer 98A are deposited in the trenches 86. The memory film90 may be deposited conformally in the trenches 86 along sidewalls ofthe conductive lines 72, the dielectric layers 52, and the IMD 70 andalong top surfaces of the dielectric layer 52E, the etch stop layer 51,and the IMD 70. The memory film 90 may be deposited by CVD, PVD, ALD,PECVD, or the like.

The memory film 90 may provide gate dielectrics for the transistors 204formed in the memory array 200. The memory film 90 may comprise amaterial that is capable of switching between two different polarizationdirections by applying an appropriate voltage differential across thememory film 90. The memory film 90 may be a high-k dielectric material,such as a hafnium (Hf) based dielectric material or the like. In someembodiments, the memory film 90 comprises a ferroelectric (FE) material,such as hafnium oxide, hafnium zirconium oxide, silicon-doped hafniumoxide, or the like. In some embodiments, the memory film 90 may comprisedifferent ferroelectric materials or different types of memorymaterials. In some embodiments, the memory film 90 may be a multilayermemory structure comprising a layer of SiN_(x) between two SiO_(x)layers (e.g., an ONO structure).

The OS layer 92 is conformally deposited in the trenches 86 over thememory film 90. The OS layer 92 comprises materials suitable forproviding channel regions for the transistors 204 (see FIGS. 1A and 1B).For example, the OS layer 92 may include zinc oxide (ZnO), indiumtungsten oxide (InWO), indium gallium zinc oxide (InGaZnO, IGZO), indiumzinc oxide (InZnO), indium tin oxide (ITO), polycrystalline silicon(poly-Si), silicon (Si), amorphous silicon (a-Si), combinations thereof,or the like. The OS layer 92 may be deposited by CVD, PVD, ALD, PECVD,or the like. The OS layer 92 may extend along sidewalls and bottomsurfaces of the trenches 86 over the memory film 90.

The first dielectric layer 98A is deposited in the trenches 86 over theOS layer 92. The first dielectric layer 98A may include, for example,silicon oxide, silicon nitride, silicon oxynitride, or the like, whichmay be deposited by CVD, PVD, ALD, PECVD, or the like. The firstdielectric layer 98A may extend along sidewalls and bottom surfaces ofthe trenches 86 over the OS layer 92. As discussed below with respect toFIGS. 17A and 17B, the first dielectric layer 98A may be subsequentlypatterned and used as a mask to etch the underlying OS layer 92.

In FIGS. 17A and 17B, bottom portions of the first dielectric layer 98Aand the OS layer 92 are removed in the trenches 86. The bottom portionsof the first dielectric layer 98A may be removed using a combination ofphotolithography and etching. The etching may be any acceptable etchprocess, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching may be anisotropic.

The first dielectric layer 98A may then be used as an etch mask to etchthrough the bottom portions of the OS layer 92 in the trenches 86. Theetching may be any acceptable etch process, such as wet or dry etching,RIE, NBE, the like, or a combination thereof. The etching may beanisotropic. Etching the OS layer 92 may expose portions of the memoryfilm 90 on bottom surfaces of the trenches 86. Thus, portions of the OSlayer 92 on opposing sidewalls of the trenches 86 may be separated fromeach other, which improves isolation between the memory cells 202 of thememory array 200 (see FIGS. 1A and 1B).

In some embodiments (not separately illustrated), the OS layer 92 maythen be used as an etch mask to etch through the bottom portions of thememory film 90 in the trenches 86. The etching may be any acceptableetch process, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching may be anisotropic. Etching the memoryfilm 90 may expose portions of the etch stop layer 51 on bottom surfacesof the trenches 86. Thus, portions of the memory film 90 on opposingsidewalls of the trenches 86 may be separated from each other, whichfurther improves isolation between the memory cells 202 of the memoryarray 200 (see FIGS. 1A and 1B).

In FIGS. 18A and 18B, additional dielectric materials 98B are depositedto fill remaining portions of the trenches 86. The additional dielectricmaterials 98B may be formed of materials and by processes the same as orsimilar to those of the first dielectric layer 98A. The additionaldielectric materials 98B and the first dielectric layer 98A may bereferred to collectively as dielectric materials 98.

In FIGS. 19A and 19B, a removal process is applied to the dielectricmaterials 98, the OS layer 92, and the memory film 90 to remove excessmaterials over the multi-layer stack 58. In some embodiments, aplanarization process such as a CMP, an etch-back process, combinationsthereof, or the like may be utilized. The planarization process exposesthe multi-layer stack 58 and the IMD 70 such that top surfaces of themulti-layer stack 58 (e.g., the dielectric layer 52E), the IMD 70, thememory film 90, the OS layer 92, and the dielectric materials 98 arelevel after the planarization process is complete.

FIGS. 20A through 23C illustrate intermediate steps of manufacturingdielectric materials 102, conductive lines 106 (e.g., bit lines), andconductive lines 108 (e.g., source lines) in the memory array 200. Theconductive lines 106 and the conductive lines 108 may extend in adirection perpendicular to the conductive lines 72 such that individualmemory cells 202 of the memory array 200 may be selected for read andwrite operations.

In FIGS. 20A and 20B, trenches 100 are patterned through the dielectricmaterials 98 and the OS layer 92. The trenches 100 may be patterned inthe dielectric materials 98 and the OS layer 92 through a combination ofphotolithography and etching. The etching may be any acceptable etchingprocesses, such as wet or dry etching, RIE, NBE, the like, or acombination thereof. The etching may be anisotropic. The trenches 100may be disposed between opposing sidewalls of the memory film 90 and thetrenches 100 may physically separate adjacent stacks of the memory cells202 in the memory array 200 (see FIG. 1A). The dielectric materials 98and the OS layer 92 may be completely removed in the first portion 68Aand the second portion 68B of the staircase structure 68 adjacent theIMD 70, the conductive lines 72, and the dielectric layers 52. Portionsof the dielectric materials 98 and the OS layer 92 adjacent the secondportion 68B of the staircase structure 68 in a direction parallel to thesecond edge E₂ and the fourth edge E₄ may also be removed.

In some embodiments (not separately illustrated), the trenches 100 mayalso be patterned through the memory film 90. As such, the trenches 100may be disposed between opposing sidewalls of the multi-layer stack 58and the trenches 100 may physically separate adjacent stacks of thememory cells 202 in the memory array 200 (see FIG. 1A). The dielectricmaterials 98, the OS layer 92, and the memory film 90 may be completelyremoved in the first portion 68A and the second portion 68B of thestaircase structure 68 adjacent the IMD 70, the conductive lines 72, andthe dielectric layers 52. Portions of the dielectric materials 98, theOS layer 92, and the memory film 90 adjacent the second portion 68B ofthe staircase structure 68 in a direction parallel to the second edge E₂and the fourth edge E₄ may also be removed.

In FIGS. 21A and 21B, dielectric materials 102 are deposited in and fillthe trenches 100. The dielectric materials 102 may include, for example,silicon oxide, silicon nitride, silicon oxynitride, or the like, whichmay be deposited by CVD, PVD, ALD, PECVD, or the like. The dielectricmaterials 102 may extend along sidewalls and bottom surfaces of thetrenches 100 over the OS layer 92. After deposition, a planarizationprocess (e.g., a CMP, an etch-back, or the like) may be performed toremove excess portions of the dielectric materials 102. In the resultingstructure, top surfaces of the multi-layer stack 58, the memory film 90,the OS layer 92, the dielectric materials 98, and the dielectricmaterials 102 may be substantially level (e.g., within processvariations) with one another.

In some embodiments, materials of the dielectric materials 98 and thedielectric materials 102 may be selected so that they may be etchedselectively relative to each other. For example, in some embodiments,the dielectric materials 98 are an oxide and the dielectric materials102 are a nitride. In some embodiments, the dielectric materials 98 area nitride and the dielectric materials 102 are an oxide. Other materialsare also possible.

In FIGS. 22A and 22B, trenches 104 are patterned through the dielectricmaterials 98. The trenches 104 may be subsequently used to formconductive lines. The trenches 104 may be patterned through thedielectric materials 98 using a combination of photolithography andetching. The etching may be any acceptable etch process, such as wet ordry etching, RIE, NBE, the like, or a combination thereof. The etchingmay be anisotropic. The etching may use etchants that etch thedielectric materials 98 without significantly etching the dielectricmaterials 102, the OS layer 92, or the memory film 90. A pattern of thetrenches 104 may correspond to that of subsequently formed conductivelines (such as the conductive lines 106 and the conductive lines 108,discussed below with respect to FIGS. 23A through 23C). Portions of thedielectric materials 98 may remain between each pair of the trenches104, and the dielectric materials 102 may be disposed between adjacentpairs of the trenches 104. Further, portions of the OS layer 92 and thememory film 90 may remain adjacent the trenches 104 between the trenches104 and each of the dielectric layers 52 and the conductive lines 72.The portions of the OS layer 92 and the memory film 90 may be used aspart of subsequently formed transistors 204. In some embodiments, adifferent etching may be used to pattern the trenches 104 as opposed tothe process used to pattern the trenches 100 in order to selectivelyetch the material of the dielectric materials 98 with respect to the OSlayer 92 and the memory film 90.

In FIGS. 23A through 23C, the trenches 104 are filled with a conductivematerial to form conductive lines 106 and conductive lines 108. FIG. 23Aillustrates reference cross-sections that are used in later figures.Cross-section B-B′ extends in a direction perpendicular to longitudinalaxes of the conductive lines 72 and extends through the dielectricmaterials 98. Cross-section C-C′ extends in a direction parallel tocross-section B-B′ and extends through the conductive lines 106 and/orthe conductive lines 108. Memory cells 202 and transistors 204 areformed, which each include a conductive line 106, a conductive line 108,a conductive line 72 a portion of the memory film 90, and a portion ofthe OS layer 92. The conductive lines 106 and the conductive lines 108may each comprise conductive materials such as copper, titanium,titanium nitride, tantalum, tantalum nitride, tungsten, ruthenium,aluminum, combinations thereof, or the like. The conductive lines 106and the conductive lines 108 may be formed using, for example, CVD, ALD,PVD, PECVD, or the like. After the conductive materials are deposited, aplanarization (e.g., a CMP, an etch-back, or the like) may be performedto remove excess portions of the conductive materials, thereby formingthe conductive lines 106 and the conductive lines 108. In the resultingstructure, top surfaces of the multi-layer stack 58, the IMD 70, thememory film 90, the OS layer 92, the dielectric materials 98, thedielectric materials 102, the conductive lines 106, and the conductivelines 108 may be substantially level (e.g., within process variations)with one another.

The conductive lines 106 may correspond to bit lines in the memory array200 and the conductive lines 108 may correspond to source lines in thememory array 200. Further, the conductive lines 106 and the conductivelines 108 may provide source/drain electrodes for the transistors 204 inthe memory array 200. Although FIG. 23C illustrates a cross-sectionalview that only shows the conductive lines 106, a cross-sectional view ofthe conductive lines 108 may be similar.

Although the channel regions for the transistors 204, the conductivelines 106, and the conductive lines 108 have been discussed as beingformed after forming the staircase structure 68, in some embodiments,the staircase structure 68 may be formed after forming the channelregions for the transistors 204, the conductive lines 106, and theconductive lines 108. For example, the manufacturing steps illustratedin and described with respect to FIGS. 4A through 12C to form thestaircase structure 68 may be performed after the manufacturing stepsillustrated in and described with respect to FIGS. 13A through 23C. Thesame or similar processes may be used in staircase-first andstaircase-last embodiments.

In FIGS. 24A through 24D, a dielectric layer 120 is formed over themulti-layer stack 58, the IMD 70, the memory film 90, the OS layer 92,the dielectric materials 98, the dielectric materials 102, theconductive lines 106, and the conductive lines 108. The dielectric layer120 may comprise a dielectric material, such as a low-k dielectricmaterial, an extra low-k (ELK) dielectric material, or the like. In someembodiments, the dielectric layer 120 may comprise insulating materials,such as silicon oxide, silicon nitride, silicon oxynitride, combinationsthereof, or the like. The dielectric layer 120 may be deposited using anappropriate process, such as, CVD, ALD, PVD, PECVD, or the like.

FIG. 24A further illustrates reference cross-sections that are used inlater figures. Cross-section A-A′ extends through the first portion 68Aof the staircase structure 68 along longitudinal axes of the conductivelines 72. Cross-section C-C′ extends through the conductive lines 106 inthe second portion 68B of the staircase structure 68 in a directionperpendicular to cross-section A-A′. Cross-section D-D′ extends throughthe dielectric materials 98 and the dielectric materials 102 adjacentthe conductive lines 72 in a direction parallel to the cross-sectionA-A′.

Further in FIGS. 24A through 24D, trenches 110 are formed in thedielectric layer 120 and the IMD 70, trenches 112 are formed in thedielectric layer 120, the dielectric materials 98, the memory film 90,and the etch stop layer 51, and trenches 114 are formed in thedielectric layer 120. The trenches 110, the trenches 112, and thetrenches 114 may subsequently be used to form conductive contacts. Morespecifically, the trenches 110 may be subsequently used to formconductive contacts extending to the conductive lines 72 (e.g., to formword line contacts, gate contacts, or the like), the trenches 112 may besubsequently used to form conductive contacts extending to the circuitsformed over the substrate 50, and the trenches 114 may be subsequentlyused to form conductive contacts extending to the conductive lines 106and the conductive lines 108 (e.g., to form bit line contacts, sourceline contacts, or the like).

As illustrated in FIGS. 24B and 24C, the trenches 110 may extend throughthe dielectric layer 120 and the IMD 70 and may expose top surfaces ofthe conductive lines 72. The staircase shape of the conductive lines 72provides surfaces on each of the conductive lines 72 to which thetrenches 110 may extend. As illustrated in FIGS. 24C and 24D, thetrenches 112 may extend through the dielectric layer 120, the dielectricmaterials 102, the memory film 90, and the etch stop layer 51. Inembodiments in which bottom portions of the memory film 90 are removed,the trenches 112 may extend through the dielectric layer 120, thedielectric materials 102, and the etch stop layer 51 only. The trenches112 may expose top surfaces of the substrate 50. In embodiments in whichthe interconnect structure 320 is formed over the substrate 50 (see FIG.2) the trenches 112 may expose top surfaces of the conductive features322 of the interconnect structure 320. As illustrated in FIGS. 24A and24C, the trenches 110 and the trenches 112 may extend through adjacentportions of the dielectric layer 120, the IMD 70, the dielectricmaterials 102, the memory film 90, and the etch stop layer 51 in a samecross-section, which cross-section is perpendicular to longitudinal axesof the conductive lines 72.

As will be discussed in greater detail below, conductive contacts (suchas the conductive contacts 122 and the conductive contacts 124,discussed below with respect to FIGS. 26A through 26E) may be formed inthe trenches 110 and the trenches 112 and the conductive contacts may beelectrically coupled to one another through conductive lines (such asthe conductive lines 128, discussed below with respect to FIGS. 26Athrough 26E). Forming the first portion 68A and the second portion 68Bof the staircase structure 68 along opposite edges of the memory array200 allows for connections to be made from each of the conductive lines72 to different portions of the underlying substrate 50. Because thefirst portion 68A and the second portion 68B of the staircase structure68 are formed along only portions of the second edge E₂ and the fourthedge E₄, the memory cells 202 may be formed along the remainder of thesecond edge E₂ and the fourth edge E₄. This allows for device density tobe increased.

As illustrated in FIGS. 24C and 24D, the trenches 114 may extend throughthe dielectric layer 120 and may expose the conductive lines 106 and theconductive lines 108. The trenches 114 may be used subsequently to formconductive contacts (e.g., source line contacts and bit line contacts,such as the conductive contacts 126 and the conductive contacts 124,discussed below with respect to FIGS. 26A through 26E) electricallycoupled to the conductive lines 106 and the conductive lines 108.

The trenches 110, the trenches 112, and the trenches 114 may be formedusing a combination of photolithography and etching. The etching may beany acceptable etch process, such as wet or dry etching, RIE, NBE, thelike, or a combination thereof. The etching may be anisotropic. In someembodiments, trenches 110, the trenches 112, and the trenches 114 may beformed simultaneously; however, the trenches 110, the trenches 112, andthe trenches 114 may also be formed separately using multiple etchingprocesses.

In FIGS. 25A through 25D, a dielectric layer 121 is formed over thedielectric layer 120. The dielectric layer 121 may comprise a dielectricmaterial, such as a low-k dielectric material, an extra low-k (ELK)dielectric material, or the like. In some embodiments, the dielectriclayer 121 may comprise insulating materials, such as silicon oxide,silicon nitride, silicon oxynitride, combinations thereof, or the like.The dielectric layer 121 may be deposited using an appropriate process,such as, CVD, ALD, PVD, PECVD, or the like. Further in FIGS. 25A through25D, trenches 116 and trenches 118 are formed in the dielectric layer121. The trenches 116 and the trenches 118 may subsequently be used toform conductive lines. More specifically, the trenches 116 may besubsequently used to form conductive lines electrically couplingsubsequently formed conductive contacts to one another and to underlyingstructures, such as circuits formed on the substrate 50.

In FIGS. 26A through 26E, conductive contacts 122 are formed in thetrenches 110, conductive contacts 124 are formed in the trenches 112,conductive contacts 126 are formed in the trenches 114, conductive lines128 are formed in the trenches 116, and conductive lines 130 are formedin the trenches 118. FIG. 26E illustrates a perspective view in whichthe IMD 70, the dielectric layer 120, and the dielectric layer 121 areomitted in order to more clearly show relationships between theconductive contacts 122, the conductive contacts 124, the conductivecontacts 126, the conductive lines 128, and the conductive lines 130 andthe other elements of the memory array 200. The conductive lines 128electrically couple the conductive contacts 122 and the conductivecontacts 124. The conductive lines 72 are electrically coupled tocircuits formed on the substrate 50 through the conductive contacts 124,the conductive lines 128, and the conductive contacts 122. Theconductive contacts 122 extend through the dielectric layer 120 and theIMD 70. The conductive contacts 122 may be referred to as word linecontacts, gate contacts, or the like. The conductive contacts 124 extendthrough the dielectric layer 120, the dielectric materials 102, thememory film 90, and the etch stop layer 51. The conductive lines 128extend through the dielectric layer 121.

Because the conductive lines 72 are formed in the staircase structure68, surfaces on each of the conductive lines 72 are provided for theconductive contacts 122 to land on. A number of the conductive lines 72may be included in the first portion 68A of the staircase structure 68and a remainder of the conductive lines 72 may be included in the secondportion 68B of the staircase structure 68 such that each of theconductive lines 72 is included in the staircase structure 68. As such,the conductive contacts 122 may extend to each of the conductive lines72. Forming the first portion 68A of the staircase structure 68 and thesecond portion 68B of the staircase structure 68 along the second edgeE₂ of the memory array 200 and the fourth edge E₄ of the memory array200 opposite the second edge E₂ allows for connections to be made todifferent portions of the underlying substrate 50. Forming the firstportion 68A of the staircase structure 68 and the second portion 68B ofthe staircase structure 68 extending only partially along the secondedge E₂ and the fourth edge E₄ of the memory array 200 also minimizesthe space taken up by the staircase structure 68. For example, memorycells 202 may be formed adjacent the first portion 68A and the secondportion 68B of the staircase structure 68 in a direction parallel withthe second edge E₂ and the fourth edge E₄ of the memory array 200, whichmaximizes the number of memory cells 202 that may be formed in thememory array 200 and increases device density.

Further, the conductive lines 128 route connections between theconductive contacts 122 and the conductive contacts 124 within the firstportion 68A and the second portion 68B of the staircase structure 68 andextend in a direction perpendicular to longitudinal axes of theconductive lines 72. This routing configuration requires less area thanconventional designs, which allows for greater device densities to beachieved. The connections may also be shorter than conventional designs,which reduces resistance and improves device performance. The trenches110 and the trenches 112 may be formed simultaneously and the conductivecontacts 122 and the conductive contacts 124 may be formedsimultaneously such that less lithography steps and less depositionsteps may be used, which reduces costs and production time.

The conductive lines 130 are electrically coupled to the conductivecontacts 126 and may electrically couple the conductive lines 106 andthe conductive lines 108 to the circuits formed on the substrate 50through the conductive contacts 126 and the conductive lines 130. Theconductive contacts 126 extend through the dielectric layer 120. Theconductive contacts 126 may be referred to as source line contacts, bitline contacts, or the like. The conductive lines 130 extend through thedielectric layer 121.

The conductive contacts 122, the conductive contacts 124, the conductivecontacts 126, the conductive lines 128, and the conductive lines 130 maybe formed by forming liners (not separately illustrated), such asdiffusion barrier layers, adhesion layers, or the like, and formingconductive materials over the liners. Each of the conductive contacts122, the conductive contacts 124, the conductive contacts 126, theconductive lines 128, and the conductive lines 130 may be formedsimultaneously, or separately using one or more deposition processes.The liners may include titanium, titanium nitride, tantalum, tantalumnitride, or the like. The conductive materials may be copper, a copperalloy, silver, gold, tungsten, cobalt, aluminum, nickel, or the like. Aplanarization process, such as a CMP, may be performed to remove excessmaterial from surfaces of the dielectric layer 121.

FIG. 27 illustrates an embodiment in which the memory cells 202 in thememory array 200 are aligned in a direction parallel to the second edgeE₂ and the fourth edge E₄. Although the memory cells 202 in a regionaligned with the first portion 68A of the staircase structure 68 in adirection parallel to the first edge E₁ and the third edge E₃ aremisaligned with the memory cells 202 in a region aligned with the secondportion 68B of the staircase structure 68 in the direction parallel tothe first edge E₁ and the third edge E₃, the memory cells 202 in bothregions may be aligned in the direction parallel to the second edge E₂and the fourth edge E₄. Aligning the memory cells 202 with one anothermay simplify the routing of connections to the memory cells 202, such asthe conductive contacts 126 and the conductive lines 130.

FIGS. 28 through 35 illustrate an embodiment in which a multi-layerstack 59 includes alternating dielectric layers 52 and sacrificiallayers 74. FIG. 28 illustrates the multi-layer stack 59 after stepssimilar to or the same as those illustrated in FIGS. 3 through 12C anddiscussed above have been performed to form the staircase structure 68and the IMD 70 over the staircase structure 68. The multi-layer stack 59includes alternating layers of sacrificial layers 74A-74D (collectivelyreferred to as sacrificial layers 74) and dielectric layers 52A-52E(collectively referred to as dielectric layers 52). The sacrificiallayers 74 may be replaced with conductive materials in subsequent stepsto define conductive lines 412 (e.g., word lines). The sacrificiallayers 74 may comprise insulating materials, such as silicon oxide,silicon nitride, silicon oxynitride, combinations thereof, or the like.The dielectric layers 52 may comprise insulating materials, such assilicon oxide, silicon nitride, silicon oxynitride, combinationsthereof, or the like. The dielectric layers 52 may be formed of amaterial having high etch selectivity from the etching of thesacrificial layers 74 and the substrate 50 may be formed of a materialhaving high etch selectivity from the etching of both the sacrificiallayers 74 and the dielectric layers 52 in order to aid with subsequentetching steps. In some embodiments, the substrate 50 may be formed ofsilicon carbide, the dielectric layers 52 may be formed of an oxide,such as silicon oxide, and the sacrificial layers 74 may be formed of anitride, such as silicon nitride. The sacrificial layers 74 and thedielectric layers 52 may each be formed using, for example, CVD, ALD,physical vapor deposition (PVD), plasma enhanced CVD (PECVD), or thelike. Although FIG. 28 illustrates a particular number of thesacrificial layers 74 and the dielectric layers 52, other embodimentsmay include different numbers of the sacrificial layers 74 and thedielectric layers 52.

In FIG. 29, first trenches 402 are formed in the multi-layer stack 59.In the illustrated embodiment, the first trenches 402 extend through themulti-layer stack 59 to expose the etch stop layer 51. In someembodiments, the first trenches 402 extend through some but not alllayers of the multi-layer stack 59, or extend through the multi-layerstack 59 and the etch stop layer 51. The first trenches 402 may beformed using acceptable photolithography and etching techniques, such aswith an etching process that is selective to the multi-layer stack 59(e.g., etches the dielectric materials of the dielectric layers 52 andthe sacrificial layers 74 at a faster rate than the material of thesubstrate 50). The etching may be any acceptable etch process, such as areactive ion etch (RIE), neutral beam etch (NBE), the like, or acombination thereof. The etching may be anisotropic. In embodiments inwhich the substrate 50 is formed of silicon carbide, the dielectriclayers 52 are formed of silicon oxide, and the sacrificial layers 74 areformed of silicon nitride, the first trenches 402 may be formed by a dryetch using a fluorine-based gas (e.g., C₄F₆) mixed with hydrogen (H₂) oroxygen (O₂) gas.

In FIG. 30, the first trenches 402 are expanded to form first sidewallrecesses 403. Specifically, portions of the sidewalls of the sacrificiallayers 74 exposed by the first trenches 402 are recessed from the firstsidewall recesses 403. Although sidewalls of the sacrificial layers 74are illustrated as being straight, the sidewalls may be concave orconvex. The first sidewall recesses 403 may be formed by an acceptableetching process, such as one that is selective to the material of thesacrificial layers 74 (e.g., selectively etches the material of thesacrificial layers 74 at a faster rate than the materials of thedielectric layers 52, the etch stop layer 51, and the substrate 50). Theetching may be isotropic. In embodiments where the substrate 50 isformed of silicon carbide, the dielectric layers 52 are formed ofsilicon oxide, and the sacrificial layers 74 are formed of siliconnitride, the first trenches 402 can be expanded by a wet etch usingphosphoric acid (H₃PO₄). However, any suitable etching process, such asa dry selective etch, may also be utilized.

In FIG. 31, a seed layer 404 and a conductive fill material 406 areformed in the first sidewall recesses 403 and to fill and/or overfillthe first trenches 402. One or more additional layers, such as seedlayers, glue layers, barrier layers, diffusion layers, fill layers, andthe like may also be filled in the first trenches 402 and the firstsidewall recesses 403. In some embodiments, the seed layer 404 may beomitted. The seed layer 404 may be formed of a first conductive materialthat can be utilized to help grow or to help adhere the subsequentlydeposited material. In some embodiments, the seed layer 404 may comprisetitanium nitride, tantalum nitride, titanium, tantalum, molybdenum,ruthenium, rhodium, hafnium, iridium, niobium, rhenium, tungsten,combinations of these, oxides of these, or the like. The conductive fillmaterial 406 may be formed of a second conductive material, which may bea metal, such as tungsten, cobalt, aluminum, nickel, copper, silver,gold, molybdenum, ruthenium, molybdenum nitride, alloys thereof, or thelike. In embodiments in which the dielectric layers 52 are formed of anoxide such as silicon oxide, the seed layer 404 can be formed oftitanium nitride and the conductive fill material 406 can be formed oftungsten. The seed layer 404 and the conductive fill material 406 mayeach be formed by an acceptable deposition process such as chemicalvapor deposition (CVD), atomic layer deposition (ALD), or the like.

Once the seed layer 404 and the conductive fill material 406 have beendeposited in order to fill and/or overfill the first trenches 402, theseed layer 404 and the conductive fill material 406 may be planarized toremove excess material outside of the first trenches 402, such thatafter the planarizing the seed layer 404 and the conductive fillmaterial 406 completely span a top portion of the first trenches 402. Inan embodiment, the seed layer 404 and the conductive fill material 406may be planarized using, for example, a chemical mechanicalplanarization (CMP) process. However, any suitable planarizationprocess, such as a grinding process, may also be utilized.

In FIG. 32, second trenches 405 are formed in the multi-layer stack 59.In the illustrated embodiment, the second trenches 405 extend throughthe multi-layer stack 59 and expose the etch stop layer 51. In someembodiments, the second trenches 405 extend through some but not alllayers of the multi-layer stack 59, or extend through the multi-layerstack 59 and the etch stop layer 51. The second trenches 405 may beformed using acceptable photolithography and etching techniques, such aswith an etching process that is selective to the multi-layer stack 59(e.g., etches the dielectric materials of the dielectric layers 52 andthe sacrificial layers 74 at a faster rate than the material of thesubstrate 50). The etching may be any acceptable etch process, and insome embodiments, may be similar to the etch used to form the firsttrenches 402 discussed with respect to FIG. 29.

In FIG. 33, the second trenches 405 are expanded to form second sidewallrecesses 407. Specifically, the remaining portions of the sacrificiallayers 74 are removed to form the second sidewall recesses 407. Thesecond sidewall recesses 407 thus expose portions of the seed layer 404or, in embodiments in which the seed layer 404 is not present, theconductive fill material 406. The second sidewall recesses 407 may beformed by an acceptable etching process, such as one that is selectiveto the material of the sacrificial layers 74 (e.g., selectively etchesthe material of the sacrificial layers 74 at a faster rate than thematerials of the dielectric layers 52, the etch stop layer 51, and thesubstrate 50). The etching may be any acceptable etch process, and insome embodiments, may be similar to the etch used to form the firstsidewall recesses 403 discussed with respect to FIG. 30.

In FIG. 34, a seed layer 408 and a conductive fill material 410 areformed in the second sidewall recesses 407 and to fill and/or overfillthe second trenches 405. The seed layer 408 and the conductive fillmaterial 410 may be formed of materials that are selected from the samegroups of candidate materials of the seed layer 404 and the conductivefill material 406, respectively, and may be formed using methods thatare selected from the same group of candidate methods for forming thematerials of the seed layer 404 and the conductive fill material 406,respectively.

Once the seed layer 408 and the conductive fill material 410 have beendeposited in order to fill and/or overfill the second trenches 405, theseed layer 408 and the conductive fill material 410 may be planarized toremoved excess material outside of the second trenches 405, such thatafter the planarizing, the seed layer 408 and the conductive fillmaterial 410 completely span a top portion of the second trenches 405.In an embodiment the seed layer 408 and the conductive fill material 410may be planarized using, for example, a chemical mechanicalplanarization (CMP) process. However, any suitable planarizationprocess, such as a grinding process, may also be utilized.

The seed layer 404, the conductive fill material 406, the seed layer408, and the conductive fill material 410 are collectively referred toas conductive lines 412. The conductive lines 412 may perform similarlyto the conductive lines 72 and may be used as word lines. Adjacent setsof the seed layer 404, the conductive fill material 406, the seed layer408, and the conductive fill material 410 are in physical contact withone another and are electrically coupled to one another. Thus, each setof the seed layer 404, the conductive fill material 406, the seed layer408, and the conductive fill material 410 functions as a single wordline.

In FIG. 35, third trenches 414 are formed extending through theconductive lines 412, forming individual conductive lines 412A-412D.Forming the third trenches 414 may expose sidewalls of the dielectriclayers 52. In some embodiments, the conductive lines 412 may be etchedusing, for example, an anisotropic etching process. However, anysuitable etching process may be utilized. In some embodiments, theetching process is performed until the material of the conductive lines412 that is not covered by the dielectric layers 52 has been removed. Assuch, the remaining material of the conductive lines 412 has a similarwidth as the remaining portion of the dielectric layers 52.

Forming the conductive lines 412 by forming and replacing thesacrificial layers 74 in the multi-layer stack 59 improves the aspectratio of columns of the memory array 200, and prevents twisting orcollapsing of features during formation. This reduces device defects andimproves device performance. The steps performed in FIGS. 28 through 35may be performed in place of the steps performed in FIGS. 13A through15C, with the remaining steps for forming the memory array 200 being thesame as those discussed above (e.g., the steps performed in FIGS. 2through 12C are performed, then the steps performed in FIGS. 28 through35 are performed, and finally, the steps performed in FIGS. 16A through26E are performed.

FIGS. 36A through 36E illustrate the embodiment of FIGS. 28 through 35after the steps of FIGS. 16A through 26E are performed. The structuresof FIGS. 36A through 36E may be similar to those illustrated in FIGS.26A through 26E, except that the conductive lines 72 are replaced by theconductive lines 412 including the seed layer 404, the conductive fillmaterial 406, the seed layer 408, and the conductive fill material 410.

Embodiments may achieve various advantages. For example, forming thefirst portion 68A of the staircase structure 68 and the second portion68B of the staircase structure 68 each extending partially along thesecond edge E₂ and the fourth edge E₄ of the memory array 200 allows forconnections to be made to various portions of the underlying substrate50, while minimizing the area taken up by the staircase structure 68,and maximizing the number of memory cells 202 formed in the memory array200. This increases device density.

In accordance with an embodiment, a memory array includes a first wordline extending from a first edge of the memory array in a firstdirection, the first word line having a length less than a length of asecond edge of the memory array, the second edge of the memory arraybeing perpendicular to the first edge of the memory array; a second wordline extending from a third edge of the memory array, the third edge ofthe memory array being opposite the first edge of the memory array, thesecond word line extending in the first direction, the second word linehaving a length less than the length of the second edge of the memoryarray; a memory film contacting the first word line; and an oxidesemiconductor (OS) layer contacting a first source line and a first bitline, the memory film being disposed between the OS layer and the firstword line. In an embodiment, the memory film includes a ferroelectric(FE) material. In an embodiment, the memory array further includes aninter-metal dielectric (IMD) over the first word line; a first contactextending through the IMD to the first word line, the first contactbeing electrically coupled to the first word line; a dielectric materialcontacting the memory film, the memory film being disposed between thedielectric material and the first word line; a second contact extendingthrough the dielectric material and the FE material; and a firstconductive line electrically coupling the first contact to the secondcontact. In an embodiment, the second contact has a length greater thana length of the first contact. In an embodiment, the memory arrayfurther includes a third word line over the first word line, the thirdword line extending from the first edge of the memory array in the firstdirection, the third word line having a length less than the length ofthe first word line. In an embodiment, the memory array further includesa second memory film contacting the first word line opposite the memoryfilm; and a second OS layer contacting a second source line and a secondbit line, the second memory film being disposed between the second OSlayer and the first word line, the second source line being aligned withone of the first source line or the first bit line in a directionparallel to the first edge of the memory array, and the second bit linebeing aligned with the other of the first source line or the first bitline in the direction parallel to the first edge of the memory array. Inan embodiment, the memory array further includes a first inter-metaldielectric (IMD) over the first word line and a second IMD over thesecond word line, the first IMD and the second IMD having staircaseshapes in a cross-sectional view.

In accordance with another embodiment, a device includes a first wordline over a semiconductor substrate; a first inter-metal dielectric(IMD) contacting a first end of the first word line; a second word lineover the semiconductor substrate, a first end of the second word linebeing aligned with a first edge of the first IMD; a second IMDcontacting a second end of the second word line opposite the first endof the second word line, a first edge of the second IMD being alignedwith a second end of the first word line opposite the first end of thefirst word line; a memory film in contact with the first word line andthe first IMD; and an oxide semiconductor (OS) layer over the memoryfilm, the OS layer contacting a source line and a bit line. In anembodiment, the first word line has a first length between the first endand the second end, the second word line has a second length between thefirst end and the second end, and the second length is equal to thefirst length. In an embodiment, a first distance between thesemiconductor substrate and the first word line in a directionperpendicular to a major surface of the semiconductor substrate is equalto a second distance between the semiconductor substrate and the secondword line in a direction perpendicular to the major surface of thesemiconductor substrate. In an embodiment, the memory film is in contactwith the second word line. In an embodiment, the first IMD and thesecond IMD have staircase shapes in a cross-sectional view. In anembodiment, a first end of the memory film and a first end of the OSlayer are aligned with the second end of the first word line.

In accordance with yet another embodiment, a method includes forming amulti-layer stack over a semiconductor substrate, the multi-layer stackincluding alternating layers of a first material and a second material;depositing a first hard mask layer over the multi-layer stack;patterning the first hard mask layer to expose a first corner region ofthe multi-layer stack and a second corner region of the multi-layerstack kitty-corner the first corner region, the first hard mask layercovering a third corner region of the multi-layer stack and a fourthcorner region of the multi-layer stack after patterning the first hardmask layer, the fourth corner region being kitty-corner the third cornerregion; patterning the multi-layer stack through the first hard masklayer to form a first staircase structure in the first corner region anda second staircase structure in the second corner region; patterning afirst trench extending through the multi-layer stack; depositing amemory film along sidewalls and a bottom surface of the first trench;and depositing an oxide semiconductor (OS) layer over the memory film.In an embodiment, the method further includes depositing an inter-metaldielectric (IMD) over the first staircase structure, the secondstaircase structure, and the first hard mask layer, patterning the firsttrench further including patterning the first trench extending throughthe IMD. In an embodiment, the method further includes planarizing theIMD and the first hard mask layer, planarizing the IMD and the firsthard mask layer removing the first hard mask layer, and top surfaces ofthe IMD being level with a top surface of the multi-layer stack afterplanarizing the IMD and the first hard mask layer. In an embodiment, themethod further includes depositing a dielectric material over the memoryfilm; forming a first conductive contact extending through the IMD to afirst conductive layer of the multi-layer stack, the first conductivecontact being electrically coupled to the first conductive layer;forming a second conductive contact extending through the dielectricmaterial and the memory film; and forming a conductive line electricallycoupling the second conductive contact with the first conductivecontact. In an embodiment, the first material includes a conductivematerial, the second material includes a dielectric material, andpatterning the first trench forms a plurality of word lines includingthe first material. In an embodiment, the first material includes anoxide dielectric material, and the second material includes a nitridedielectric material. In an embodiment, the method further includesreplacing the second material with a conductive material.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A memory array comprising: a first word lineextending from a first edge of the memory array in a first direction,the first word line having a length less than a length of a second edgeof the memory array, the second edge of the memory array beingperpendicular to the first edge of the memory array; a second word lineextending from a third edge of the memory array, the third edge of thememory array being opposite the first edge of the memory array, thesecond word line extending in the first direction, the second word linehaving a length less than the length of the second edge of the memoryarray; a memory film contacting the first word line; and an oxidesemiconductor (OS) layer in physical contact with a first source lineand a first bit line, wherein the memory film is disposed between the OSlayer and the first word line.
 2. The memory array of claim 1, whereinthe memory film comprises a ferroelectric (FE) material.
 3. The memoryarray of claim 2, further comprising: an inter-metal dielectric (IMD)over the first word line; a first contact extending through the IMD tothe first word line, wherein the first contact is electrically coupledto the first word line; a dielectric material contacting the memoryfilm, wherein the memory film is disposed between the dielectricmaterial and the first word line; a second contact extending through thedielectric material and the FE material; and a first conductive lineelectrically coupling the first contact to the second contact.
 4. Thememory array of claim 3, wherein the second contact has a length greaterthan a length of the first contact.
 5. The memory array of claim 1,further comprising a third word line over the first word line, the thirdword line extending from the first edge of the memory array in the firstdirection, the third word line having a length less than the length ofthe first word line.
 6. The memory array of claim 1, further comprising:a second memory film contacting the first word line opposite the memoryfilm; and a second OS layer contacting a second source line and a secondbit line, wherein the second memory film is disposed between the secondOS layer and the first word line, wherein the second source line isaligned with one of the first source line or the first bit line in adirection parallel to the first edge of the memory array, and whereinthe second bit line is aligned with the other of the first source lineor the first bit line in the direction parallel to the first edge of thememory array.
 7. The memory array of claim 1, further comprising a firstportion of an inter-metal dielectric (IMD) over the first word line anda second portion of the IMD over the second word line, wherein the firstportion of the IMD and the second portion of the IMD have staircaseshapes in a cross-sectional view, and wherein the second portion of theIMD is separated from the first portion of the IMD.
 8. A devicecomprising: a first word line over a semiconductor substrate; a firstportion of an inter-metal dielectric (IMD) contacting a first end of thefirst word line; a second word line over the semiconductor substrate,wherein a first end of the second word line is aligned with a first edgeof the first portion of the IMD; a second portion of the IMD contactinga second end of the second word line opposite the first end of thesecond word line, wherein a first edge of the second portion of the IMDis aligned with a second end of the first word line opposite the firstend of the first word line, wherein the second portion of the IMD isseparated from the first portion of the IMD, and wherein a top surfaceof the second portion of the IMD is level with a top surface of thefirst portion of the IMD; a memory film in contact with the first wordline and the first portion of the IMD; and an oxide semiconductor (OS)layer over the memory film, the OS layer contacting a source line and abit line.
 9. The device of claim 8, wherein the first word line has afirst length between the first end and the second end, wherein thesecond word line has a second length between the first end and thesecond end, and wherein the second length is equal to the first length.10. The device of claim 9, wherein a first distance between thesemiconductor substrate and the first word line in a directionperpendicular to a major surface of the semiconductor substrate is equalto a second distance between the semiconductor substrate and the secondword line in a direction perpendicular to the major surface of thesemiconductor substrate.
 11. The device of claim 8, wherein the memoryfilm is in contact with the second word line.
 12. The device of claim 8,wherein the first portion of the IMD and the second portion of the IMDhave staircase shapes in a cross-sectional view.
 13. The device of claim8, wherein a first end of the memory film and a first end of the OSlayer are aligned with the second end of the first word line.
 14. Amethod comprising: forming a multi-layer stack over a semiconductorsubstrate, the multi-layer stack comprising alternating layers of afirst material and a second material; depositing a first hard mask layerover the multi-layer stack; patterning the first hard mask layer toexpose a first corner region of the multi-layer stack and a secondcorner region of the multi-layer stack kitty-corner the first cornerregion, wherein the first hard mask layer covers a third corner regionof the multi-layer stack and a fourth corner region of the multi-layerstack after patterning the first hard mask layer, wherein the fourthcorner region is kitty-corner the third corner region; patterning themulti-layer stack through the first hard mask layer to form a firststaircase structure in the first corner region and a second staircasestructure in the second corner region; patterning a first trenchextending through the multi-layer stack; depositing a memory film alongsidewalls and a bottom surface of the first trench; and depositing anoxide semiconductor (OS) layer over the memory film.
 15. The method ofclaim 14, further comprising depositing an inter-metal dielectric (IMD)over the first staircase structure, the second staircase structure, andthe first hard mask layer, wherein patterning the first trench furthercomprises patterning the first trench extending through the IMD.
 16. Themethod of claim 15, further comprising planarizing the IMD and the firsthard mask layer, wherein planarizing the IMD and the first hard masklayer removes the first hard mask layer, and wherein top surfaces of theIMD are level with a top surface of the multi-layer stack afterplanarizing the IMD and the first hard mask layer.
 17. The method ofclaim 15, further comprising: depositing a dielectric material over thememory film; forming a first conductive contact extending through theIMD to a first conductive layer of the multi-layer stack, wherein thefirst conductive contact is electrically coupled to the first conductivelayer; forming a second conductive contact extending through thedielectric material and the memory film; and forming a conductive lineelectrically coupling the second conductive contact with the firstconductive contact.
 18. The method of claim 14, wherein the firstmaterial comprises a conductive material, wherein the second materialcomprises a dielectric material, and wherein patterning the first trenchforms a plurality of word lines comprising the first material.
 19. Themethod of claim 14, wherein the first material comprises an oxidedielectric material, and wherein the second material comprises a nitridedielectric material.
 20. The method of claim 19, further comprisingreplacing the second material with a conductive material.